Patent · US Active

Determining endpoint in a substrate process

US8130382B2 · kind B2 · utility

1Cited by
21References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 28, 2011
Grant dateMar 6, 2012
Priority date
Expiry dateJun 28, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J37/32963
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

An endpoint detection method for detecting an endpoint of a process comprises determining a reflectance spectrum of light reflected from a substrate, the light having a wavelength, processing the substrate while light having the wavelength is reflected from the substrate, detecting light having the wavelength after the light is reflected from the substrate, generating a signal trace of the intensity of the reflected light and normalizing the signal trace with the reflectance spectrum of the light. The normalized signal trace can then be evaluated to determine an endpoint of the process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.