Inventor · Fremont, CA, US

Lei Lian

33Patents
7h-index
39Co-inventors
69Inventor score

Filing activity: Nov 1, 2002 → Mar 25, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US7169625B2 Method for automatic determination of semiconductor plasma chamber matching and source of fault by comprehensive plasma monitoring Electricity 61 Expired
US7306696B2 Interferometric endpoint determination in a substrate etching process Electricity 25 Expired
US8257546B2 Method and system for monitoring an etch process Electricity 18 Active
US9200950B2 Pulsed plasma monitoring using optical sensor and a signal analyzer forming a mean waveform Physics 15 Active
US7652774B2 Interferometric endpoint determination in a substrate etching process Electricity 14 Active
US7158221B2 Method and apparatus for performing limited area spectral analysis Electricity 11 Expired
US11114286B2 In-situ optical chamber surface and process sensor Electricity 9 Active
US8009938B2 Advanced process sensing and control using near infrared spectral reflectometry Physics 7 Active
US8232212B2 Within-sequence metrology based process tuning for adaptive self-aligned double patterning Electricity 7 Active
US7330244B2 Method and apparatus for performing limited area spectral analysis Electricity 4 Active
US9601396B2 3D NAND staircase CD control by using interferometric endpoint detection Electricity 4 Active
US11421977B2 Eliminating internal reflections in an interferometric endpoint detection system Electricity 3 Active
US7695987B2 Method for automatic determination of semiconductor plasma chamber matching and source of fault by comprehensive plasma monitoring Electricity 3 Active
US7808651B2 Determining endpoint in a substrate process Electricity 3 Active
US9240359B2 3D NAND staircase CD control by using interferometric endpoint detection Electricity 2 Active
US7969581B2 Determining endpoint in a substrate process Electricity 2 Active
US8956886B2 Embedded test structure for trimming process control Electricity 2 Active
US7815812B2 Method for controlling a process for fabricating integrated devices Emerging Cross-Sectional Technologies 2 Active
US8274645B2 Method and apparatus for in-situ metrology of a workpiece disposed in a vacuum processing chamber Physics 2 Active
US11709477B2 Autonomous substrate processing system Physics 2 Active
US7602484B2 Method and apparatus for performing limited area spectral analysis Electricity 1 Active
US7393459B2 Method for automatic determination of substrates states in plasma processing chambers Physics 1 Expired
US11719952B2 Adjustable achromatic collimator assembly for endpoint detection systems Physics 1 Active
US8130382B2 Determining endpoint in a substrate process Electricity 1 Active
US12265377B2 Autonomous substrate processing system Physics 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.