Integrated circuit system with metal-insulator-metal circuit element

US8134196B2 · kind B2 · utility

Assignee

• STATS ChipPAC, Ltd. · SG

Inventors

• Yaojian Lin · Singapore, SG
• Haijing Cao · Singapore, SG
• Wan Lay Looi · Kota Tinggi, MY
• Eng Seng Lim · Singapore, SG

Key dates

• Filing date: Sep 1, 2006
• Grant date: Mar 13, 2012
• Expiry date: Aug 28, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D1/696

Abstract

An integrated circuit system is provided including forming a substrate, forming a first contact having multiple conductive layers over the substrate and a layer of the multiple conductive layers on other layers of the multiple conductive layers, forming a dielectric layer on the first contact, and forming a second contact on the dielectric layer and over the first contact.