Semiconductor module and method

US8134838B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Mark Essert · Lippstadt, DE
• Martin Knecht · Erwitte, DE
• Alexander Ciliox · Greiffenberg, DE

Key dates

• Filing date: Jul 21, 2008
• Grant date: Mar 13, 2012
• Expiry date: Jan 2, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19041
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor module and a method. One embodiment provides a housing with a housing frame and a pluggable carrier which is plugged in the housing frame. The pluggable carrier is equipped with a lead which includes an internal portion which is arranged inside the housing, and an external portion which is arranged outside the housing. The internal portion is electrically coupled to an electric component of the power semiconductor module. The external portion allows for electrically coupling the power semiconductor module.