Bevel clean device
US8137501B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2007 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Mar 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02087
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for removing material on a bevel of a wafer is provided. A wafer support with a diameter that is less than the diameter of the wafer, wherein the wafer support is on a first side of the wafer, and wherein an outer edge of the wafer extends beyond the wafer support around the wafer is provided. An RF power source is electrically connected to the wafer. A central cover is spaced apart from the wafer support. A first electrically conductive ring is on the first side of and spaced apart from the wafer. A second electrically conductive ring is spaced apart from the wafer. An electrically conductive liner surrounds the outer edge of the wafer. A switch is between the liner and ground, allowing the liner to be switched from being grounded to floating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.