Package system for shielding semiconductor dies from electromagnetic interference
US8138024B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2008 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Jul 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a package system includes: providing a semiconductor die with a contact pad and a ground pad, mounting the semiconductor die on a package substrate using and adhesive layer, forming a vertical conductive structure on top of the ground pad in the semiconductor die, encapsulating at least portions of the semiconductor die, the vertical conductive structure, and the package substrate using an encapsulant, covering at least portions of the encapsulant and the vertical conductive structure with a shielding layer to place the vertical conductive structure in electrical contact with the shielding layer, and connecting the shielding layer to the package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.