Patent · US Active

Polymer thermal interface materials

US8138239B2 · kind B2 · utility

14Cited by

2References

12Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Ed Prack · Phoenix, US
Yi Li · Chandler, US
Wei Wu · Portland, US

Key dates

Filing date	Dec 23, 2008
Grant date	Mar 20, 2012
Priority date	—
Expiry date	Jan 19, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/254
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material, wherein the spherical filler material comprises a metallic core with an organic solderability preservative coating. Other embodiments are also disclosed and claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.