Semiconductor devices and methods of manufacture thereof
US8138539B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2007 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Dec 31, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a capacitor plate includes a plurality of first parallel conductive members, and a plurality of second parallel conductive members disposed over the plurality of first parallel conductive members. A first base member is coupled to an end of the plurality of first parallel conductive members, and a second base member is coupled to an end of the plurality of second parallel conductive members. A connecting member is disposed between the plurality of first parallel conductive members and the plurality of second parallel conductive members, wherein the connecting member includes at least one elongated via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.