Copper foil for printed circuit board and copper clad laminate for printed circuit board
US8142905B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2009 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | May 29, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/273
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a copper foil for a printed circuit board comprising a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to a “nickel zinc layer”) on a roughened surface of a copper foil, and a chromate film layer on the nickel zinc layer, wherein the zinc add-on weight per unit area of the nickel zinc layer is 180 μg/dm2 or more and 3500 μg/dm2 or less, and the nickel weight ratio in the nickel zinc layer {nickel add-on weight/(nickel add-on weight+zinc add-on weight)} is 0.38 or more and 0.7 or less. This surface treatment technology of a copper foil is able to effectively prevent the circuit corrosion phenomenon in cases of laminating a copper foil on a resin base material and using a sulfuric acid hydrogen peroxide etching solution to perform soft etching to the circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.