Methods for monitoring the amount of contamination imparted into semiconductor wafers during wafer processing
US8143078B2 · kind B2 · utility
2Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2010 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Dec 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/24
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods are disclosed for monitoring the amount of metal contamination imparted during wafer processing operations such as polishing and cleaning. The methods include subjecting a silicon-on-insulator structure to the semiconductor process, precipitating metal contamination in the structure and delineating the metal contaminants.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.