Structures for semiconductor structures with error detection and correction
US8146046B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2008 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Jan 17, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A design structure including design data describing a semiconductor structure. The semiconductor structure includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip is on top of and bonded to the second semiconductor chip. The first and second semiconductor chips include a first and a second electric nodes. The second semiconductor chip further includes a first comparing circuit. The semiconductor structure further includes a first coupling via electrically connecting the first electric node of the first semiconductor chip to the first comparing circuit of the second semiconductor chip. The first comparing circuit is capable of (i) receiving an input signal from the second electric node directly, (ii) receiving an input signal from the first electric node indirectly through the first coupling via, and (iii) asserting a first mismatch signal in response to the input signals from the first and second electric nodes being different.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.