Inventor · Ridgefield, CT, US

Timothy J. Dalton

175Patents
25h-index
220Co-inventors
93Inventor score

Filing activity: May 28, 1993 → Sep 16, 2014

Most-cited inventions

PatentTitleAreaCited byStatus
US6153935A Dual etch stop/diffusion barrier for damascene interconnects Electricity 315 Expired
US6551924B1 Post metalization chem-mech polishing dielectric etch Electricity 235 Expired
US5450205A Apparatus and method for real-time measurement of thin film layer thickness and changes thereof Physics 207 Expired
US7193423B1 Wafer-to-wafer alignments Electricity 204 Expired
US7045453B2 Very low effective dielectric constant interconnect structures and methods for fabricating the same Electricity 199 Expired
US7023093B2 Very low effective dielectric constant interconnect Structures and methods for fabricating the same Electricity 104 Expired
US6635506B2 Method of fabricating micro-electromechanical switches on CMOS compatible substrates Performing Operations; Transporting 83 Expired
US6451712B1 Method for forming a porous dielectric material layer in a semiconductor device and device formed Electricity 71 Expired
US6358832B1 Method of forming barrier layers for damascene interconnects Electricity 68 Expired
US6649531B2 Process for forming a damascene structure Electricity 60 Expired
US6815329B2 Multilayer interconnect structure containing air gaps and method for making Electricity 58 Expired
US9201041B2 Extended gate sensor for pH sensing Physics 55 Active
US6975032B2 Copper recess process with application to selective capping and electroless plating Electricity 51 Expired
US7361991B2 Closed air gap interconnect structure Electricity 48 Expired
US7394332B2 Micro-cavity MEMS device and method of fabricating same Emerging Cross-Sectional Technologies 45 Expired
US7531407B2 Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating same Electricity 43 Active
US6617690B1 Interconnect structures containing stress adjustment cap layer Electricity 40 Expired
US8024012B2 Intelligent wireless power charging system Electricity 30 Active
US7670921B2 Structure and method for self aligned vertical plate capacitor Electricity 29 Active
US7365001B2 Interconnect structures and methods of making thereof Electricity 27 Expired
US6720249B1 Protective hardmask for producing interconnect structures Electricity 27 Expired
US7514271B2 Method of forming high density planar magnetic domain wall memory Emerging Cross-Sectional Technologies 26 Active
US6838355B1 Damascene interconnect structures including etchback for low-k dielectric materials Electricity 26 Expired
US7282148B2 Porous silicon composite structure as large filtration array Performing Operations; Transporting 25 Expired
US7657995B2 Method of fabricating a microelectromechanical system (MEMS) switch Emerging Cross-Sectional Technologies 25 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.