Methods of forming III/V semiconductor materials, and semiconductor structures formed using such methods
US8148252B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2011 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Mar 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/811
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of forming ternary III-nitride materials include epitaxially growing ternary III-nitride material on a substrate in a chamber. The epitaxial growth includes providing a precursor gas mixture within the chamber that includes a relatively high ratio of a partial pressure of a nitrogen precursor to a partial pressure of one or more Group III precursors in the chamber. Due at least in part to the relatively high ratio, a layer of ternary III-nitride material may be grown to a high final thickness with small V-pit defects therein. Semiconductor structures including such ternary III-nitride material layers are fabricated using such methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.