Method for measuring the creep of a thin film inserted between two rigid substrates, with one cantilever end
US8152364B2 · kind B2 · utility
2Cited by
11References
12Claims
0Family size
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Key dates
| Filing date | Dec 16, 2008 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Jul 24, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0094
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A film is inserted between two rigid substrates which form a sample. The sample is fixed at a first end in a device for measuring creep. The device comprises means for applying a predetermined force on a free end of the sample. The film being sheared, study of its creep can be performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.