Apparatus and method for inspecting micro-structured devices on a semiconductor substrate

US8154718B2 · kind B2 · utility

Assignee

• Vistec Semiconductor Systems GmbH · DE

Inventors

• Uwe Graf · Solms, DE
• Lambert Danner · Wetzlar, DE

Key dates

• Filing date: May 23, 2005
• Grant date: Apr 10, 2012
• Expiry date: Jul 15, 2025

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N21/9505
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Previously used examination devices and methods mostly operate with reflected visible or UV light to analyze microstructured samples of a wafer (38), for example. The aim of the invention is to increase the possible uses of said devices, i.e. particularly in order to represent structural details, e.g. of wafers that are structured on both sides, which are not visible in VIS or UV because coatings or intermediate materials are not transparent. Said aim is achieved by using IR light as reflected light while creating transillumination (52) which significantly improves contrast in the IR image, among other things, thus allowing the sample to be simultaneously represented in reflected or transmitted IR light and in reflected visible light.