Sputtering target fixture
US8157970B2 · kind B2 · utility
0Cited by
10References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2008 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Jan 3, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/35
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for sputter deposition. The method including: providing a sputter target having a back surface and an exposed front surface; providing a source of magnetic field lines, the magnetic field lines extending through the sputter target from the back surface to the exposed front surface of the sputter target; providing one or more pole extenders between magnetic poles of the source of the magnetic field lines and the exposed front surface of the sputter target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.