Sputtering target/backing plate bonded body
US8157973B2 · kind B2 · utility
6Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2007 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Mar 15, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3407
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a sputtering target/backing plate assembly having a structure such that pure copper is embedded in a backing plate position at the central portion of the target, within sputtering target/copper-zinc alloy backing plate bonded bodies. Consequently, provided is a simple structure of sputtering target/backing plate capable of sufficiently accommodating further high-power sputtering without deteriorating the characteristics of a copper-zinc alloy backing plate that is inexpensive and excels in strength and anti-eddy current characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.