Semiconductor package having an internal cooling system
US8159065B2 · kind B2 · utility
9Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2009 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Jun 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package having an internal cooling system is presented which includes a semiconductor chip and a through-electrode. The semiconductor chip has a circuit section. The through-electrode passes through an upper surface and a lower surface the semiconductor chip. The through-electrode is electrically connected with the circuit section of the semiconductor chip. The through-electrode also has a through-hole for allowing cooling fluid to flow therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.