Photosensitive composition, method for forming pattern, and method for manufacturing semiconductor device
US8163462B2 · kind B2 · utility
2Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2009 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Jun 9, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/114
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a photosensitive composition, which is capable of being irradiated with high energy beam having a wave length of 1 to 300 nm band. The photosensitive composition includes a binder resin; and a photoelectron absorbent, capable of being excited with photoelectron emitted from the binder resin that absorbs the high energy beam, when the binder resin is irradiated with the high energy beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.