Integrated circuit package system using etched leadframe
US8163604B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2005 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Feb 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system includes a conductive substrate. A heat sink and a plurality of leads are etched in the substrate to define a conductive film connecting the heat sink and the plurality of leads to maintain their spatial relationship. A die is attached to the heat sink and wire bonded to the plurality of leads. An encapsulant is formed over the die, the heat sink, and the plurality of leads. The conductive film is etched away to expose the encapsulant and the bottom surfaces of the heat sink and the plurality of leads. Wave soldering is used to form solder on at least the plurality of leads. Multiple heat sinks and hanging leads are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.