Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip
US8164182B2 · kind B2 · utility
5Cited by
24References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2005 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Nov 28, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3656
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package system is provided including mounting a semiconductor chip to a substrate having a substrate opening. A first heat slug is attached to a first surface of the semiconductor chip at least partially encapsulating the semiconductor chip. A second heat slug is attached to the second surface of the semiconductor chip through the substrate opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.