Method and device for producing a bondable area region on a carrier

US8167187B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Reinhold Bayerer · Warstein, DE
• Thomas Licht · Warstein, DE
• Alfred Kemper · Warstein, DE

Key dates

• Filing date: Apr 28, 2006
• Grant date: May 1, 2012
• Expiry date: Jun 13, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method and a device is provided for levelling an area region on the surface of a metal or metallization layer of a carrier. The area region is made planar by the action of a stamp or of a roller.