Handling system for inspecting and sorting electronic components
US8167524B2 · kind B2 · utility
3Cited by
13References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2007 |
| Grant date | May 1, 2012 |
| Priority date | — |
| Expiry date | May 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67271
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package handling system is provided comprising a package holder for receiving and holding singulated semiconductor packages, and a first inspection device which is arranged and configured to inspect a first surface of the packages while they are being held by the package holder. An offloading device receives the packages from the package holder and conveys them packages to an offloader, and a second inspection device is arranged and configured to inspect a second surface of the packages which is opposite from the first surface while they are being held by the offloading device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.