Chemical-mechanical planarization pad
US8172648B2 · kind B2 · utility
13Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2008 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Jul 15, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/346
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the pad is abraded the surface is renewed exposing at least a portion of the chemical agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.