Method for producing a semiconductor wafer with rear side identification

US8173534B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Stephan Bradl · Regensburg, DE
• Rainer Holmer · Steinach, DE

Key dates

• Filing date: Feb 28, 2011
• Grant date: May 8, 2012
• Expiry date: Mar 15, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor wafer with rear side identification and to a method for producing the same is disclosed. In one embodiment, the rear side identification has a multiplicity of information regarding the monocrystalline and surface and also rear side constitution. A multiplicity of semiconductor device positions arranged in rows and columns are provided on the top side of the semiconductor wafer, an information chip being arranged at an exposed semiconductor device position, the information chip having at least the information of the rear side identification.