Apparatus and methods for cleaning and drying of wafers
US8177993B2 · kind B2 · utility
27Cited by
18References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2006 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Apr 2, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An first example method and apparatus for etching and cleaning a substrate comprises device with a first manifold and a second manifold. The first manifold has a plurality of nozzles for dispensing chemicals onto the substrate. The second manifold is attached to a vacuum source and/or a dry air/gas source. A second example embodiment is a wafer cleaning device and method that uses a manifold with capillary jet nozzles and a liquid capillary jet stream to clean substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.