Integrated circuit package system for shielding electromagnetic interference
US8178956B2 · kind B2 · utility
15Cited by
28References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2007 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Jun 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system includes: providing a substrate; coupling an integrated circuit to the substrate; mounting a shielding element around the integrated circuit; applying a conductive shielding layer on the shielding element; and coupling a system interconnect to the shielding element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.