Support mounted electrically interconnected die assembly
US8178978B2 · kind B2 · utility
70Cited by
25References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2009 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Sep 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.