Inventor · San Jose, CA, US

Marc E. Robinson

18Patents
10h-index
33Co-inventors
72Inventor score

Filing activity: Aug 22, 1997 → Apr 21, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US6271598A Conductive epoxy flip-chip on chip Electricity 71 Expired
US8178978B2 Support mounted electrically interconnected die assembly Electricity 70 Active
US7215018B2 Stacked die BGA or LGA component assembly Electricity 63 Expired
US6098278A Method for forming conductive epoxy flip-chip on chip Emerging Cross-Sectional Technologies 57 Expired
US7245021B2 Micropede stacked die component assembly Electricity 38 Expired
US7535109B2 Die assembly having electrical interconnect Electricity 32 Active
US8723332B2 Electrically interconnected stacked die assemblies Electricity 28 Active
US8629543B2 Electrically interconnected stacked die assemblies Electricity 15 Active
US8357999B2 Assembly having stacked die mounted on substrate Electricity 14 Active
US8704379B2 Semiconductor die mount by conformal die coating Electricity 12 Active
US9305862B2 Support mounted electrically interconnected die assembly Electricity 4 Active
US9824999B2 Semiconductor die mount by conformal die coating Electricity 1 Active
US9252116B2 Semiconductor die mount by conformal die coating Electricity 1 Active
US12113142B2 Strings of solar cells having laser assisted metallization conductive contact structures and their methods of manufacture Emerging Cross-Sectional Technologies 0 Active
US11664472B2 Laser assisted metallization process for solar cell stringing Emerging Cross-Sectional Technologies 0 Active
US7705432B2 Three dimensional six surface conformal die coating Electricity 0 Expired
US12080815B2 Laser assisted metallization process for solar cell stringing Emerging Cross-Sectional Technologies 0 Active
US8729690B2 Assembly having stacked die mounted on substrate Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.