Method for electroless plating and metal-plated article
US8182873B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2004 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Jan 19, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for metal plating with good adhesion to materials that are difficult to plate wherein a material to be plated is surface-treated with a silane coupling agent having in a molecule thereof a functional group with a metal-capturing capability, is heat treated at a high temperature of at least 150° C. in air or an inert gas atmosphere, surface treatment is performed with a solution containing a noble metal compound, and electroless plating is performed. Alternatively, a metal plating method is provided wherein a material to be plated is surface-treated with a liquid in which a noble metal compound and a silane coupling agent having in a molecule thereof a functional group with a metal-capturing capability have already been mixed or reacted, is heat treated at a high temperature of at least 150° C. in air or an inert gas atmosphere, and electroless plating is performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.