Junnosuke Sekiguchi
22Patents
3h-index
16Co-inventors
52Inventor score
Filing activity: Jul 11, 2002 → Feb 9, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7045461B2 | Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these | Chemistry; Metallurgy | 10 | Expired |
| US7138040B2 | Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode | Chemistry; Metallurgy | 5 | Expired |
| US7799188B2 | Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode | Chemistry; Metallurgy | 3 | Active |
| US7968150B2 | Method of surface treatment using imidazole compound | Emerging Cross-Sectional Technologies | 3 | Active |
| US7179741B2 | Electroless plating method and semiconductor wafer on which metal plating layer is formed | Electricity | 3 | Expired |
| US9034154B2 | Sputtering target and process for producing same | Chemistry; Metallurgy | 2 | Active |
| US7648621B2 | Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion | Chemistry; Metallurgy | 2 | Expired |
| US8089154B2 | Electronic component formed with barrier-seed layer on base material | Electricity | 1 | Active |
| US8734579B2 | Aqueous solution containing divalent iron ions | Chemistry; Metallurgy | 1 | Active |
| US7943033B2 | Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode | Chemistry; Metallurgy | 1 | Active |
| US8283051B2 | Plated product having copper thin film formed thereon by electroless plating | Emerging Cross-Sectional Technologies | 1 | Active |
| US8182873B2 | Method for electroless plating and metal-plated article | Chemistry; Metallurgy | 1 | Active |
| US8333834B2 | High-purity aqueous copper sulfonate solution and method of producing same | Chemistry; Metallurgy | 0 | Active |
| US8247301B2 | Substrate and manufacturing method therefor | Electricity | 0 | Active |
| US8390123B2 | ULSI micro-interconnect member having ruthenium electroplating layer on barrier layer | Chemistry; Metallurgy | 0 | Active |
| US8163400B2 | Plated article having metal thin film formed by electroless plating, and manufacturing method thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US9234292B2 | Nickel-iron alloy plating solution | Electricity | 0 | Active |
| US8736057B2 | Substrate and manufacturing method therefor | Electricity | 0 | Active |
| US8004082B2 | Electronic component formed with barrier-seed layer on base material | Electricity | 0 | Active |
| US8395264B2 | Substrate comprising alloy film of metal element having barrier function and metal element having catalytic power | Electricity | 0 | Active |
| US8404035B2 | Electroless copper plating solution | Chemistry; Metallurgy | 0 | Active |
| US8394508B2 | Plated article having metal thin film formed by electroless plating | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.