Device including a semiconductor chip

US8183677B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventor

• Georg Meyer-Berg · Birkenfeld, DE

Key dates

• Filing date: Nov 26, 2008
• Grant date: May 22, 2012
• Expiry date: Mar 16, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A device including a semiconductor chip. One embodiment provides a device, including a metal layer having a first layer face. A semiconductor chip includes a first chip face. The semiconductor chip is electrically coupled to and placed over the metal layer with the first chip face facing the first layer face. An encapsulation material covers the first layer face and the semiconductor chip. At least one through-hole extends from the first layer face through the encapsulation material. The at least one through-hole is accessible from outside the device.