Assembly of two parts of an integrated electronic circuit
US8186568B2 · kind B2 · utility
52Cited by
28References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2008 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Mar 31, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for assembling two parts of an integrated electronic circuit has two successive steps. During a first step, the two circuit parts are made into a single unit by molecular bonding, realized on respective application surfaces of the two parts. During a second step, electrical connections are formed from connection portions already present in the application surfaces of the two circuit parts. The connections formed extend across the bonding interface, and are compatible with a high reliability and a high level of integration of the circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.