Circuit board having electrically connecting structure and fabrication method thereof
US8188377B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2008 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Nov 27, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49147
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board having an electrically connecting structure and a method for fabricating the same are provided. A circuit board body having inner-layer circuits is provided. A circuit layer is formed on at least an outermost surface of circuit board body, and including electrically connecting pads and circuits. The electrically connecting pads are partially electrically connected to the circuits, and are partially electrically connected to the inner-layer circuits via conductive vias. An insulating protective layer is disposed on the circuit board body and is formed with openings therein for exposing the electrically connecting pads. Conductive posts are formed on the electrically connecting pads. Standalone metal pads are formed on the insulating protective layer but are not used for electrical connection. The conductive posts and electrically connecting pads are absent from the insulating protective layer beneath the standalone metal pads, such that circuits can be formed under the insulating protective layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.