Electronic device including a conductive structure extending through a buried insulating layer
US8188543B2 · kind B2 · utility
7Cited by
23References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2006 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Apr 4, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B10/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device can include a substrate, a buried insulating layer overlying the substrate, and a semiconductor layer overlying the buried insulating layer, wherein the semiconductor layer is substantially monocrystalline. The electronic device can also include a conductive structure extending through the semiconductor layer and buried insulating layer and abutting the substrate, and an insulating spacer lying between the conductive structure and each of the semiconductor layer and the buried insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.