Paul Hui
7Patents
6h-index
11Co-inventors
49Inventor score
Filing activity: Dec 31, 2002 → Nov 3, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6734524B1 | Electronic component and method of manufacturing same | Electricity | 12 | Expired |
| US6930027B2 | Method of manufacturing a semiconductor component | Electricity | 12 | Expired |
| US7045189B2 | Molding for automotive application | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6945592B1 | Sealer tape and clip assembly | Performing Operations; Transporting | 8 | Expired |
| US8188543B2 | Electronic device including a conductive structure extending through a buried insulating layer | Electricity | 7 | Active |
| US7615866B2 | Contact surrounded by passivation and polymide and method therefor | Electricity | 6 | Active |
| US7820519B2 | Process of forming an electronic device including a conductive structure extending through a buried insulating layer | Electricity | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.