Patent · US Active

Direct-write wafer level chip scale package

US8188584B1 · kind B1 · utility

39Cited by
365References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 19, 2010
Grant dateMay 29, 2012
Priority date—
Expiry dateMar 19, 2030

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/14
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method and structure provides a Direct Write Wafer Level Chip Scale Package (DWWLCSP) that utilizes permanent layers/coatings and direct write techniques to pattern these layers/coatings, thereby avoiding the use of photoimagable materials and photo-etching processes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.