Reducing joint embrittlement in lead-free soldering processes
US8191757B2 · kind B2 · utility
4Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2008 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Feb 11, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2991
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In the manufacture of products such as printed wiring boards or chip scale packaging and ball grid arrays, incorporating one or more elements selected from among Ni, Co, Cr, Mn, Zr, Fe and Si into a lead-free soldering process to reduce joint embrittlement. In varied embodiments this is accomplished by spraying onto a solder sphere or preform surface, by spraying onto a device substrate surface, or by incorporating into the device substrate alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.