Optimization of metallurgical properties of a solder joint
US8197612B2 · kind B2 · utility
2Cited by
16References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2008 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Mar 21, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/36
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.