Signal shifting to allow independent control of identical stacked memory modules
US8198717B1 · kind B1 · utility
12Cited by
0References
5Claims
0Family size
Assignee
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Key dates
| Filing date | May 8, 2009 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Mar 31, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A memory device having die-stacking modules that are interchangeable within a Package-on-Package (PoP) and provide separate Chip Enable (CE) signals for all memory die in the die-stacking modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.