Semiconductor chip and semiconductor package including the same
US8198719B2 · kind B2 · utility
2Cited by
0References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 14, 2010 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Dec 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip includes a semiconductor chip body, a through-silicon via and a silicon pattern. The semiconductor chip body has a first surface and a second surface facing away from the first surface. The through-silicon via is formed to pass through the semiconductor chip body and has a metal layer and an insulation layer which protrude from the second surface. The silicon pattern is formed on a sidewall of the protruding through-silicon via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.