Method of applying the analysis of scrub mark morphology and location to the evaluation and correction of semiconductor testing, analysis, and manufacture
US8198906B2 · kind B2 · utility
1Cited by
15References
24Claims
0Family size
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Key dates
| Filing date | Jul 1, 2010 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Jul 1, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
By examining scrub mark properties (such as position and size) directly, the performance of a wafer probing process may be evaluated. Scrub mark images are captured, image data measured, and detailed information about the process is extracted through analysis. The information may then be used to troubleshoot, improve, and monitor the probing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.