Photo-mask and wafer image reconstruction
US8200002B2 · kind B2 · utility
16Cited by
30References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2009 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Sep 30, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system receives a mask pattern and a first image of at least a portion of a photo-mask corresponding to the mask pattern. The system determines a second image of at least the portion of the photo-mask based on the first image and the mask pattern. This second image is characterized by additional spatial frequencies than the first image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.