Projection exposure apparatus with optimized adjustment possibility
US8203696B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2011 |
| Grant date | Jun 19, 2012 |
| Priority date | — |
| Expiry date | Mar 23, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70891
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A projection apparatus for microlithography for imaging an object field includes an objective, one or a plurality of manipulators for manipulating one or a plurality of optical elements of the objective, a control unit for regulating or controlling the one or the plurality of manipulators, a determining device for determining at least one or a plurality of image aberrations of the objective, a memory comprising upper bounds for one or a plurality of specifications of the objective, including upper bounds for image aberrations and/or movements for the manipulators, wherein when determining an overshooting of one of the upper bounds by one of the image aberrations and/or an overshooting of one of the upper bounds by one of the manipulator movements by regulation or control of at least one manipulator within at most 30000 ms, or 10000 ms, or 5000 ms, or 1000 ms, or 200 ms, or 20 ms, or 5 ms, or 1 ms, an undershooting of the upper bounds can be effected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.