Patent · US Active

Method for mounting electronic components on a support

US8209858B2 · kind B2 · utility

4Cited by

4References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Roland Speckels · Kamen, DE
Karsten Guth · Soest, DE

Key dates

Filing date	Jan 26, 2007
Grant date	Jul 3, 2012
Priority date	—
Expiry date	Jun 11, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/53183
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An arrangement for mounting a multiplicity of components (9, 10), particularly with irregular surface topography, on a support (7) using an assembly tool which has a tool substructure (5) and a tool superstructure (6), where the tool substructure (5) is designed to receive the support and the components which are to be mounted thereon, and the tool superstructure (6) has, in addition to an arrangement (11, 12) for transmitting assembly forces, an arrangement for compensating for tilts between the components and the support and/or an arrangement for compensating for irregular surface topologies.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.