Device for damping vibrations in projection exposure apparatuses for semiconductor lithography
US8212992B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2011 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Mar 11, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/7085
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A changeable assembly for a projection exposure apparatus for semiconductor lithography contains at least one damping element. Projection exposure apparatus for semiconductor lithography and measuring assemblies for a projection exposure apparatus for semiconductor lithography can include at least one sensor for detecting parameters and vibrations of the projection exposure apparatus, wherein the measuring assembly is embodied in such a way that it can be inserted into an exchange opening, provided for an optical element, in the projection exposure apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.