Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer
US8213705B2 · kind B2 · utility
1Cited by
17References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 22, 2011 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Feb 22, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods for identifying an edge of a care area for an array area formed on a wafer and/or for binning defects detected in the array area are provided. One method for identifying an edge of a care area for an array area formed on a wafer includes determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area. The method also includes identifying the position that is located closest to the inside of the array area and that has the value greater than a threshold as a position of the edge of the care area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.