Enhanced thermal management for improved module reliability
US8214658B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2008 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Jul 20, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Mitigating effects of delamination of components in the data processing system is provided. A signal is received from one or more sensors in the data processing system. A determination is made as to whether the signal indicates that one threshold in a plurality of thresholds has been reached or exceeded. Responsive to the signal indicating that one threshold in the plurality of thresholds has been reached or exceeded, a determination is made as to whether the one threshold is a low temperature threshold or a high temperature threshold. Responsive to the one threshold being a low temperature threshold, one of a plurality of actions is initiated to increase a temperature of the data processing system thereby mitigating effects of delamination of the components in the data processing system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.