Substrate cleaning method and substrate cleaning apparatus
US8216389B2 · kind B2 · utility
4Cited by
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5Claims
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Key dates
| Filing date | Mar 9, 2009 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Aug 2, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A substrate cleaning method that includes: a step in which, while a substrate holder is being continuously rotated, a to-be-discharged position of the cleaning liquid on the substrate is changed to an eccentric position deviated from the central part of the substrate, and a gas is discharged from a gas nozzle to the central part of the substrate so as to form a dried area of the cleaning liquid under a condition in which a shortest distance between an edge of a cleaning liquid flow output from the cleaning-liquid nozzle and an edge of a gas flow output from the gas nozzle is set between 9 mm and 15 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.