Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof
US8217502B2 · kind B2 · utility
126Cited by
3References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 8, 2010 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Oct 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a pillar ball; mounting an interposer having a first functional side and a second functional side over the pillar ball and a semiconductor chip; encapsulating the interposer, the pillar ball, and the semiconductor chip with an encapsulation; forming a via through the first functional side and the second functional side of the interposer, and through the encapsulation to expose a portion of the pillar ball; and filling the via with a pillar post.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.